Số hiệu tiêu chuẩn
EN 60749-14
Tên tiêu chuẩn
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003)
Ngày phát hành
2003-10-00
Tiêu chuẩn tương đương
DIN EN 60749-14 (2004-07), IDT * BS EN 60749-14 (2003-12-15), IDT * NF C96-022-14 (2004-01-01), IDT * IEC 60749-14 (2003-08), IDT * SN EN 60749-14 (2003), IDT * OEVE/OENORM EN 60749-14 (2004-08-01), IDT * PN-EN 60749-14 (2004-06-15), IDT * PN-EN 60749-14 (2005-11-18), IDT * SS-EN 60749-14 (2004-03-22), IDT * UNE-EN 60749-14 (2004-06-11), IDT * TS EN 60749-14 (2008-04-29), IDT * STN EN 60749-14 (2004-06-01), IDT * CSN EN 60749-14 (2004-06-01), IDT * DS/EN 60749-14 (2004-03-15), IDT * NEN-EN-IEC 60749-14:2003 en;fr (2003-11-01), IDT
Từ khóa
Atmospheric pressure * Bending stress * Changes of temperature * Climate * Climatic tests * Components * Connections * Dimensions * Electrical engineering * Electrical measurement * Electronic engineering * Electronic equipment and components * Enclosures * Environment * Environmental testing * Environmental tests * Flammability * Flat pack * Heat * Integrated circuits * Mechanical testing * Metal casings * Moisture * Resistance * Semiconductor devices * Semiconductors * Strength of materials * Temperature * Testing * Testing conditions * Tightness * Torque * Types * Visual inspection (testing) * Density * Impermeability * Freedom from holes * Lines