The test methods described include mechanical tests (such as bond strength, robustness of terminations, vibration, shock, solderability and accelaration), climatic tests (such as low air pressure und change of temperature), flammability tests etc., and are applicable to discrete devices and integrated circuits. For non-cavity devices additional test methods may be required.
Số hiệu tiêu chuẩn
IEC 60749*CEI 60749
Tên tiêu chuẩn
Semiconductor devices. Mechanical and climatic test methods
Ngày phát hành
1984-00-00
Tiêu chuẩn tương đương
DIN IEC 60749 (1987-09), IDT * 86/20093 DC (1986-02-07), MOD * 87/25380 DC (1987-07-13), MOD * BS 6493-3 (1986-01-31), IDT * BS CECC 90200 (1988-02-29), NEQ * UTE C96-009U (1989-08-01), IDT * SEV-ASE 3610 (1987), IDT * SS-IEC 749 (1991-10-16), IDT * UNE 20699 (1992-10-15), IDT * GOST 28578 (1990), IDT * DS/IEC 749 (1986), IDT * NEN 10749 (1985), IDT
Từ khóa
Climate * Climatic tests * Components * Electrical engineering * Electrical measurement * Electronic engineering * Electronic equipment and components * Environmental testing * Integrated circuits * Mechanical testing * Semiconductor devices * Semiconductors * Testing
IEC 60749*CEI 60749
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