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IEC 60749-14*CEI 60749-14

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

Số trang: 36
Ngày phát hành: 2003-08-00

Liên hệ
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
Số hiệu tiêu chuẩn
IEC 60749-14*CEI 60749-14
Tên tiêu chuẩn
Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)
Ngày phát hành
2003-08-00
Trạng thái
Có hiệu lực
Tiêu chuẩn tương đương
DIN EN 60749-14 (2004-07), IDT * BS EN 60749-14 (2003-12-15), IDT * EN 60749-14 (2003-10), IDT * NF C96-022-14 (2004-01-01), IDT * OEVE/OENORM EN 60749-14 (2004-08-01), IDT * PN-EN 60749-14 (2004-06-15), IDT * PN-EN 60749-14 (2005-11-18), IDT * SS-EN 60749-14 (2004-03-22), IDT * UNE-EN 60749-14 (2004-06-11), IDT * STN EN 60749-14 (2004-06-01), IDT * CSN EN 60749-14 (2004-06-01), IDT * DS/EN 60749-14 (2004-03-15), IDT * NEN-EN-IEC 60749-14:2003 en;fr (2003-11-01), IDT
Tiêu chuẩn liên quan
IEC 60749-8*CEI 60749-8 (2002-08)
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
Số hiệu tiêu chuẩn IEC 60749-8*CEI 60749-8
Ngày phát hành 2002-08-00
Mục phân loại 31.080.01. Thiết bị bán dẫn nói chung
Trạng thái Có hiệu lực
Thay thế cho
IEC 47/1701/FDIS (2003-04) * IEC 60749 (1996-10, t) * IEC 60749 AMD 1 (2000-07, t) * IEC 60749 AMD 2 (2001-10, t) * IEC 60749 Edition 2.2 (2002-04, t) * IEC/PAS 62184 (2000-08)
Thay thế bằng
Lịch sử ban hành
IEC 60749-14*CEI 60749-14*IEC 47/1701/FDIS (2003-04)*IEC 60749 (1996-10, t)*IEC 60749 AMD 1 (2000-07, t)*IEC 60749 AMD 2 (2001-10, t)*IEC 60749 Edition 2.2 (2002-04, t)*IEC/PAS 62184 (2000-08) * IEC 60749-14 (2003-08) * IEC 47/1701/FDIS (2003-04) * IEC 47/1615/CDV (2002-03) * IEC/PAS 62184 (2000-08)
Từ khóa
Atmospheric pressure * Bending stress * Changes of temperature * Climate * Climatic tests * Components * Dimensions * Electrical engineering * Electrical measurement * Electronic engineering * Electronic equipment and components * Enclosures * Environment * Environmental testing * Environmental tests * Flammability * Flat pack * Heat * Integrated circuits * Mechanical testing * Metal casings * Moisture * Resistance * Semiconductor devices * Semiconductors * Strength of materials * Temperature * Testing * Testing conditions * Tightness * Torque * Types * Visual inspection (testing) * Impermeability * Freedom from holes * Density
Mục phân loại
31.080.01. Thiết bị bán dẫn nói chung
Số trang
36

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