Specifies a qualitative method applicable to all fluxes, solder pastes and flux cored solder wires. Describes the principle, the reagents and materials, the apparatus, the test pieces, the test procedure, the examination of the test piece, the expression of results, and the contents of the test report.
Số hiệu tiêu chuẩn
ISO 9455-14
Tên tiêu chuẩn
Soft soldering fluxes; test methods; part 14: assessment of tackiness of flux residues
Ngày phát hành
1991-12-00
Tiêu chuẩn tương đương
SANS 9455-14:1991*SABS ISO 9455-14:1991 (1999-12-20) * DIN EN 29455-14 (1994-02), IDT * DIN ISO 9455-14 (1992-08), IDT * BS EN 29455-14 (1993-12-15), IDT * EN 29455-14 (1993-08), IDT * prEN 29455-14 (1992-09), IDT * NF A81-365-14 (1993-11-01), IDT * JIS Z 3197 (1999-03-20), MOD * JIS Z 3197 (2012-03-21), MOD * OENORM EN 29455-14 (1993-11-01), IDT * OENORM EN 29455-14 (1992-12-01), IDT * PN-EN 29455-14 (2002-03-29), IDT * SS-ISO 9455-14 (1994-01-21), IDT * SS-EN 29455-14 (1994-01-21), IDT * UNE-EN 29455-14 (1996-02-06), IDT * TS EN 29455-14 (2002-04-03), IDT * CSN EN 29455-14 (1995-11-01), IDT * DS/ISO 9455-14 (1994-08-04), IDT * NEN-ISO 9455-14:1993 en (1993-09-01), IDT * SABS ISO 9455-14:1991 (1999-12-20), IDT
Tiêu chuẩn liên quan
ISO 1634-1 (1987-06) * ISO 9453 (1990-12)
Thay thế cho
ISO/DIS 9455-14 (1990-09)
Từ khóa
Adhesion * Adhesive force * Determination * Fluxes (materials) * Physical testing * Residues * Soldering * Solderings * Testing * Welding * Welding engineering * Welding fillers * Liability * Bonding
.png)
.jpg){kind=logo}
.jpg){kind=logo}
-_-logo.png){kind=logo}
