Specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. Applicable to all fluxes, solder pastes and flux cored solder wires, particularly appropriate for application where flux residues are left in situ on electrical and electronic equipment
Số hiệu tiêu chuẩn
SANS 9455-14:1991*SABS ISO 9455-14:1991
Tên tiêu chuẩn
Soft soldering fluxes - Test methods Part 14: Assessment of tackiness of flux residues
Ngày phát hành
1999-12-20
Tiêu chuẩn tương đương
ISO 9455-14 1991 IDT
Tiêu chuẩn liên quan
ISO 1634-1 * ISO 9453
Từ khóa
FILLERS * FLUXES * PHYSICAL TESTING * RESIDUE * SOLDERING * SOLDERS * TESTING * WELDING * Rivers * Physical testing * Fillers * Brazing * Residue * Solders * Fluxes * Testing * Welding * Soldering
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