IEC 61191-3*CEI 61191-3

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

1998-08-00

Có hiệu lực

DIN EN 61191-3 (1999-06), IDT * ABNT NBR IEC 61191-3 (2012-11-13), IDT * BS EN 61191-3 (1999-01-15), IDT * GB/T 19247.3 (2003), IDT * EN 61191-3 (1998-10), IDT * NF C90-705 (2000-04-01), IDT * JIS C 61191-3 (2006-03-25), IDT * SN EN 61191-3 (1998), IDT * OEVE EN 61191-3 (1998-12-04), IDT * PN-EN 61191-3 (2002-09-15), IDT * PN-EN 61191-3 (2005-08-29), IDT * SS-EN 61191-3 (1998-12-11), IDT * GOST R IEC 61191-3 (2010), IDT * STN EN 61191-3 (2001-07-01), IDT * CSN EN 61191-3 (1999-10-01), IDT * DS/EN 61191-3 (1999-11-08), IDT * NEN-EN-IEC 61191-3:1999 en;fr (1999-02-01), IDT

IEC 61191-1 (1998-08)

IEC 91/133/FDIS (1998-04)

IEC 61191-3*CEI 61191-3*IEC 91/133/FDIS (1998-04) * IEC 61191-3 (1998-08) * IEC 91/133/FDIS (1998-04) * IEC 91/98/CDV (1996-03)

Electrical engineering * Electronic * Electronic equipment and components * Electronically-operated devices * Erecting (construction operation) * Holes * Printed circuits * Printed-circuit boards * Sectional specification * SMD * Soldered * Specification * Specification (approval) * Surface mounting * Trough-hole mounting * Surface mounting devices

31.180. Mạch và bảng in

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