Số hiệu tiêu chuẩn
EN 60749-19
Tên tiêu chuẩn
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength (IEC 60749-19:2003)
Ngày phát hành
2003-04-00
Tiêu chuẩn tương đương
DIN EN 60749-19 (2003-10), IDT * DIN EN 60749-19 (2011-01), IDT * BS EN 60749-19+A1 (2003-06-20), IDT * NF C96-022-19 (2003-08-01), IDT * IEC 60749-19 (2003-02), IDT * SN EN 60749-19 (2003-04), IDT * OEVE/OENORM EN 60749-19 (2003-11-01), IDT * OEVE/OENORM EN 60749-19 (2011-03-01), IDT * PN-EN 60749-19 (2003-12-15), IDT * PN-EN 60749-19 (2005-12-30), IDT * SS-EN 60749-19 (2003-10-20), IDT * UNE-EN 60749-19 (2003-11-21), IDT * TS EN 60749-19 (2008-04-29), IDT * STN EN 60749-19 (2003-11-01), IDT * CSN EN 60749-19 (2003-12-01), IDT * DS/EN 60749-19 (2003-08-11), IDT * NEN-EN-IEC 60749-19:2003 en;fr (2003-06-01), IDT
Từ khóa
Chips * Climate * Climatic tests * Components * Electrical engineering * Electrical measurement * Electronic engineering * Electronic equipment and components * Enclosures * Environmental testing * Integrated circuits * Mechanical testing * Semiconductor devices * Semiconductors * Shear strength * Strength of materials * Testing