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DS/EN 60068-2-20

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

Số trang: 28
Ngày phát hành: 2008-10-23

Liên hệ
This part of IEC 60068 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58.This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering.NOTE Information about wetting time and wetting force can be obtained by test methods using a wetting balance.See IEC 60068-2-54 (solder bath method) and IEC 60068-2-69 (solder bath and solder globule method for SMDs).
Số hiệu tiêu chuẩn
DS/EN 60068-2-20
Tên tiêu chuẩn
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
Ngày phát hành
2008-10-23
Trạng thái
Có hiệu lực
Tiêu chuẩn tương đương
IEC 60068-2-20 Ed. 5.0:2008, IDT * IDTEN 60068-2-20:2008, IDT
Tiêu chuẩn liên quan
Thay thế cho
DS/IEC 68-2-20:1989
Thay thế bằng
Lịch sử ban hành
DS/EN 60068-2-20*DS/IEC 68-2-20:1989
Từ khóa
AGEING (MATERIALS) * BRAZING * CHRONOMETERS * COMPONENTS * DEFINITION * DEFINITIONS * DESCRIPTIONS * ELECTRICAL COMPONENTS * ELECTRICAL ENGINEERING * ELECTRICITY * ELECTRONIC ENGINEERING * ELECTRONIC EQUIPMENT AND COMPONENTS * ENVIRONMENT * ENVIRONMENTAL TESTING * ENVIRONMENTAL TESTS * FINAL MEASUREMENTS * FLAT CONNECTORS * FLUXES (MATERIALS) * INITIAL MEASUREMENTS * LAMINATES * MATERIALS TESTING * PRINTED CIRCUITS * PRINTED-CIRCUIT BOARDS * SOLDERABILITY * SOLDERING TEMPERATURE RESISTANCE * SOLDERINGS * SOLDERS * SPECIFICATION * SPECIMENS * TEMPERATURE * TEST GROUP * TESTING * WELDING ENGINEERING * SOLDERING * Environmental tests * Ageing (materials) * Chronometers * Printed-circuit boards * Environment * Final measurements * Welding engineering * Descriptions * Soldering temperature resistance * Soldering * Testing * Temperature * Environmental testing * Laminates * Printed circuits * Electrical engineering * Solderability * Flat connectors * Materials testing * Components * Electrical components * Fluxes (materials) * Test group * Electronic engineering * Solderings * Definitions * Electricity * Initial measurements * Specification * Brazing * Solders * Ingredients * Electronic equipment and components * Specimens
Mục phân loại
Số trang
28