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IEC 60749-19*CEI 60749-19

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test

Số trang: 20
Ngày phát hành: 2003-02-00

Liên hệ
Số hiệu tiêu chuẩn
IEC 60749-19*CEI 60749-19
Tên tiêu chuẩn
Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test
Ngày phát hành
2003-02-00
Trạng thái
Có hiệu lực
Tiêu chuẩn tương đương
DIN EN 60749-19 (2003-10), IDT * DIN EN 60749-19 (2011-01), IDT * BS EN 60749-19+A1 (2003-06-20), IDT * EN 60749-19 (2003-04), IDT * NF C96-022-19 (2003-08-01), IDT * OEVE/OENORM EN 60749-19 (2003-11-01), IDT * OEVE/OENORM EN 60749-19 (2011-03-01), IDT * PN-EN 60749-19 (2003-12-15), IDT * PN-EN 60749-19 (2005-12-30), IDT * SS-EN 60749-19 (2003-10-20), IDT * UNE-EN 60749-19 (2003-11-21), IDT * STN EN 60749-19 (2003-11-01), IDT * CSN EN 60749-19 (2003-12-01), IDT * DS/EN 60749-19 (2003-08-11), IDT * NEN-EN-IEC 60749-19:2003 en;fr (2003-06-01), IDT
Tiêu chuẩn liên quan
Thay thế cho
IEC 47/1664/FDIS (2002-10) * IEC 60749 (1996-10, t) * IEC 60749 AMD 1 (2000-07, t) * IEC 60749 AMD 2 (2001-10, t) * IEC 60749 Edition 2.2 (2002-04, t)
Thay thế bằng
Lịch sử ban hành
IEC 60749-19*CEI 60749-19*IEC 47/1664/FDIS (2002-10)*IEC 60749 (1996-10, t)*IEC 60749 AMD 1 (2000-07, t)*IEC 60749 AMD 2 (2001-10, t)*IEC 60749 Edition 2.2 (2002-04, t) * IEC 60749-19 (2003-02) * IEC 47/1664/FDIS (2002-10) * IEC 47/1590/CDV (2001-11)
Từ khóa
Chips * Climate * Climatic tests * Components * Electrical engineering * Electrical measurement * Electronic engineering * Electronic equipment and components * Enclosures * Environmental testing * Integrated circuits * Mechanical testing * Semiconductor devices * Semiconductors * Shear strength * Strength of materials * Testing
Số trang
20