Số hiệu tiêu chuẩn
IEC 60749-22*CEI 60749-22
Tên tiêu chuẩn
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
Ngày phát hành
2002-09-00
Tiêu chuẩn tương đương
DIN EN 60749-22 (2003-12), IDT * BS EN 60749-22 (2003-07-04), IDT * EN 60749-22 (2003-06), IDT * NF C96-022-22 (2003-11-01), IDT * OEVE/OENORM EN 60749-22 (2004-01-01), IDT * PN-EN 60749-22 (2004-06-15), IDT * PN-EN 60749-22 (2006-01-30), IDT * SS-EN 60749-22 (2004-03-22), IDT * UNE-EN 60749-22 (2004-03-26), IDT * TS EN 60749-22 (2009-04-09), IDT * STN EN 60749-22 (2004-01-01), IDT * CSN EN 60749-22 (2003-12-01), IDT * DS/EN 60749-22+Corr.1 (2004-03-15), IDT * NEN-EN-IEC 60749-22:2003 en;fr (2003-08-01), IDT
Thay thế cho
IEC 47/1394/FDIS (1996-03) * IEC 47/1477/FDIS (2000-02) * IEC 60749 (1996-10, t) * IEC 60749 AMD 1 (2000-07, t) * IEC 60749 AMD 2 (2001-10, t) * IEC 60749 Edition 2.2 (2002-04, t)
Lịch sử ban hành
IEC 60749-22*CEI 60749-22*IEC 47/1394/FDIS (1996-03)*IEC 47/1477/FDIS (2000-02)*IEC 60749 (1996-10, t)*IEC 60749 AMD 1 (2000-07, t)*IEC 60749 AMD 2 (2001-10, t)*IEC 60749 Edition 2.2 (2002-04, t) * IEC 60749-22 (2002-09) * IEC 47/1477/FDIS (2000-02) * IEC 47/1428/CDV (1998-07) * IEC 47/1394/FDIS (1996-03)
Từ khóa
Bond strength * Climatic tests * Components * Electrical engineering * Electronic engineering * Electronic equipment and components * Environmental testing * Environmental tests * Integrated circuits * Mechanical testing * Semiconductor devices * Semiconductors * Testing
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