DoD Adopted. IPC-A-610F illustrates industry-accepted workmanship criteria for electronics assemblies. This revision includes two new SMT termination styles, as well as changes in plated-through hole fill and BGA void criteria. Major topics include flex attachment, board-in-board, part-on-part, both lead-free and tin-lead criteria, component orientation and soldering criteria for through hole, SMT, cleaning, marking, coating and laminate requirements. The document synchronizes to the requirements expressed in other industry consensus documents and is most often used with the material and process standard IPC J-STD-001. 424 pages. Released July 2014.