Loading data. Please wait

IEC 60249-3-1*CEI 60249-3-1

Base materials for printed circuits. Part 3 : Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards

Số trang: 20
Ngày phát hành: 1981-00-00

Liên hệ
Gives the requirements of properties of two types of epoxide resin impregnated woven glass fabric with the resin cured to a B-stage. They are used for bonding together printed circuits formed from metal-clad epoxide glass laminates to produce multilayer printed boards. Specifies requirement for designations, materials, construction, bonding sheet material and methods of test for bonding sheet material.
Số hiệu tiêu chuẩn
IEC 60249-3-1*CEI 60249-3-1
Tên tiêu chuẩn
Base materials for printed circuits. Part 3 : Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
Ngày phát hành
1981-00-00
Trạng thái
Hết hiệu lực
Tiêu chuẩn tương đương
DIN IEC 60249-3-1 (1986-10), IDT * BS 2782-7 Method 721A (1988-07-29), NEQ * BS 4584-103.1 (1990-02-28), IDT * NF C93-741 (1996-01-01), NEQ * NF C93-750 (1984-10-01), IDT * JIS C 6521 (1996-01-01), MOD * JIS C 6522 (1996-01-01), MOD * SEV-ASE 3611-3-1 (1988), IDT * SS-IEC 249-3-1 (1996-06-14), IDT * GOST 26246.14 (1991), IDT * TS 4690 (1986-02-11), IDT * NEN 10249-3-1 (1982), IDT * CSN IEC 249-3-1 (1996-01-01), IDT * NEN 10249-3-1:1982 en;fr (1982-10-01), IDT
Tiêu chuẩn liên quan
Thay thế cho
Thay thế bằng
Lịch sử ban hành
IEC 60249-3-1*CEI 60249-3-1 (1981)
Base materials for printed circuits. Part 3 : Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
Số hiệu tiêu chuẩn IEC 60249-3-1*CEI 60249-3-1
Ngày phát hành 1981-00-00
Mục phân loại 31.180. Mạch và bảng in
Trạng thái Có hiệu lực
Từ khóa
Base materials * Electrical engineering * Electronic engineering * Electronic equipment and components * Impregnated materials * Inspection * Laminated foils * Materials * Multilayer printed boards * Packages * Prepreg * Printed circuits * Production * Properties * Semi-finished products * Specification (approval) * Specifications * Technical data sheets * Testing * Special materials * Glass fabrics * Adhesive films * Bonding sheets
Mục phân loại
Số trang
20