Provides a means of assessing the usability in electronic devices, for applications involving glass-to-metal seals, or other uses relying on the formation and presence of an adherent film of copper oxide. The procedure includes preparation and heating in air of a test piece, followed by rapid cooling in water and visual examination for loss of the oxide film or blistering.
Số hiệu tiêu chuẩn
ISO 4746
Tên tiêu chuẩn
Oxygen-free copper; Scale adhesion test
Ngày phát hành
1977-08-00
Tiêu chuẩn tương đương
BS 3839 (1978-11-30), NEQ * BS 5909 (1980-04-30), IDT * PN-ISO 4746 (1998-12-10), IDT * TS 4251 (1984-04-25), IDT * NEN-ISO 4746 (1988), IDT * NP-3425 (1986), IDT * UNI 8687 (1984), MOD * NEN-ISO 4746:1988 en (1988-08-01), IDT
Từ khóa
Adhesion tests * Copper * Non-ferrous metals * Oxide coatings * Products * Scale (corrosion) * Testing * Tests * Electrolytic
.png)
.jpg){kind=logo}
.jpg){kind=logo}
-_-logo.png){kind=logo}
