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IEC 61188-5-3*CEI 61188-5-3

Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

Số trang: 29
Ngày phát hành: 2007-10-00

Liên hệ
Số hiệu tiêu chuẩn
IEC 61188-5-3*CEI 61188-5-3
Tên tiêu chuẩn
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
Ngày phát hành
2007-10-00
Trạng thái
Có hiệu lực
Tiêu chuẩn tương đương
DIN EN 61188-5-3 (2008-07), IDT * BS EN 61188-5-3 (2007-12-31), IDT * EN 61188-5-3 (2007-11), IDT * OEVE/OENORM EN 61188-5-3 (2008-08-01), IDT * PN-EN 61188-5-3 (2008-05-19), IDT * SS-EN 61188-5-3 (2008-03-25), IDT * GOST IEC 61188-5-3 (2013), IDT * STN EN 61188-5-3 (2008-08-01), IDT * CSN EN 61188-5-3 (2008-04-01), IDT * DS/EN 61188-5-3 (2008-03-07), IDT * NEN-EN-IEC 61188-5-3:2007 en (2007-12-01), IDT
Tiêu chuẩn liên quan
IEC 61188-5-1 (2002-07)
Thay thế cho
IEC 91/702/FDIS (2007-07)
Thay thế bằng
Lịch sử ban hành
IEC 61188-5-3*CEI 61188-5-3*IEC 91/702/FDIS (2007-07) * IEC 61188-5-3 (2007-10) * IEC 91/702/FDIS (2007-07) * IEC 91/463/CDV (2004-06)
Từ khóa
Applications * Assemblies * Chips * Components * Connections * Design * Developments * Dimensions * Discrete devices * Electrical engineering * Electronic engineering * Electronic equipment * Electronic equipment and components * Erecting (construction operation) * Geometry * Gull-wing-leads * Land pattern * Manufacturing * Mounting * Packages * Printed circuits * Printed-circuit boards * Resistance * SMD * Soldered joints * Soldering * Soldering processes * Specification (approval) * Structural systems * Subracks * Surface mounting * Surface mounting devices * Terminal areas * Testing * Tolerances (measurement) * Brazing * Lines * Implementation * Use
Mục phân loại
Số trang
29