Số hiệu tiêu chuẩn
IEC 61190-1-3 AMD 1*CEI 61190-1-3 AMD 1
Tên tiêu chuẩn
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Ngày phát hành
2010-06-00
Tiêu chuẩn tương đương
DIN EN 61190-1-3 (2011-04), IDT * EN 61190-1-3/A1 (2010-09), IDT * NF C90-700-1-3/A1 (2010-12-01), IDT * OEVE/OENORM EN 61190-1-3 (2011-05-01), IDT * PN-EN 61190-1-3/A1 (2010-12-15), IDT * SS-EN 61190-1-3 A 1 (2010-11-22), IDT * CSN EN 61190-1-3 ed. 2 (2008-01-01), IDT * DS/EN 61190-1-3/A1 (2010-12-19), IDT * NEN-EN-IEC 61190-1-3:2007/A1:2010 en (2010-10-01), IDT
Thay thế cho
IEC 91/920/FDIS (2010-03)
Từ khóa
Alloys * Applications * Assemblies * Chemical composition * Classification * Composition * Connecting devices * Definitions * Designations * Electrical engineering * Electronic engineering * Erecting (construction operation) * Fluxes (materials) * Inspection * Lead free * Metal content * Non-leaded * Qualifications * Quality * Quality assurance * Sectional specification * Solder alloys * Soldering pastes * Solderings * Solders * Specification (approval) * Testing * Implementation * Use
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