IEC 60317-28:2013 specifies the requirements of enamelled rectangular copper winding wire of class 180 with a sole coating based on polyesterimide resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. NOTE - A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor dimensions covered by this standard is: - width: min. 2,0 mm max. 16,0 mm; - thickness: min. 0,80 mm max. 5,60 mm. Wires of grade 1 and grade 2 are included in this specification and apply to the complete range of conductors. The specified combinations of width and thickness as well as the specified width/thickness ratio are given in IEC 60317-0-2:2013. This second edition cancels and replaces the first edition published in 1990, Amendment 1:1997 and Amendment 2:2007. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition: - new subclause containing general notes on winding wire, formerly a part of the scope; - revision to references to IEC 60317-0-2:2013 to clarify that their application is normative; - new 3.3, Appearance; - deletion of Clause 22, High temperature failure; - modification to Clause 23, Pin hole test. Keywords: requirements of enamelled rectangular copper winding wire, class 180, sole coating based on polyesterimide resin This publication is to be read in conjunction with
IEC 60317-0-2:2013.
Số hiệu tiêu chuẩn
SFS-EN ISO 11442-2
Tên tiêu chuẩn
Technical product documentation. Handling of computer-based technical information. Part 2: Original documentation (ISO 11442-2:1993)
Ngày phát hành
1997-07-11
Tiêu chuẩn tương đương
EN ISO 11442-2:1996, IDT
Thay thế bằng
SFS-EN ISO 11442 (2010-09)
Lịch sử ban hành
SFS-EN ISO 11442 (2010-09)*SFS-EN ISO 11442-2 * SFS-EN ISO 11442-2 (1997-07)
Từ khóa
COMPUTER APPLICATIONS * DATA PROCESSING * DOCUMENTATIONS * INFORMATION EXCHANGE * PRODUCT DESIGN * PRODUCTS DOCUMENTATION * Information exchange * Computer applications * Product development * Data processing * Products documentation * Data exchange * Product design