IEC 60512-6*CEI 60512-6

Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 6 : Climatic tests and soldering tests

1984-00-00

Có hiệu lực

DIN 41640-25 (1984-09), IDT * DIN 41640-26 (1982-06), IDT * DIN 41640-31 (1979-03), IDT * DIN 41640-32 (1979-03), IDT * DIN 41640-33 (1979-03), IDT * DIN 41640-34 (1984-11), IDT * DIN 41640-70 (1985-04), IDT * DIN 41640-71 (1985-06), IDT * DIN 41640-76 (1988-01), IDT * DIN IEC 60512-6 (1994-05), IDT * BS 5772 Part 6 (1979-11-30), IDT * BS 5772-6 (1984-11-30), IDT * GB/T 5095.6 (1997), IDT * NF C93-400 (1985-04-01), IDT * JIS C 5402 (1992-11-01), MOD * JIS C 5441 (1994-03-01), MOD * SEV-ASE 3599-6 (1987), IDT * SS-IEC 512-6 (1996-06-14), IDT * UNE 20606-6 (1986-11-15), IDT * GOST 28381 (1989), IDT * NEN 10512-6 (1980), MOD * DS/IEC 512-6 (1987-01-01), IDT * NEN 10512-6:1985 en;fr (1985-06-01), IDT

IEC 60512-11-2 (2002-02, t) * IEC 60512-11-3 (2002-02, t) * IEC 60512-11-4 (2002-02, t) * IEC 60512-11-5 (2002-02, t) * IEC 60512-11-6 (2002-02, t) * IEC 60512-11-7 (1996-01, t) * IEC 60512-11-8 (1995-11, t) * IEC 60512-11-9 (2002-02, t) * IEC 60512-11-10 (2002-02, t) * IEC 60512-11-11 (2002-02, t) * IEC 60512-11-12 (2002-02, t) * IEC 60512-11-13 (2002-02, t) * IEC 60512-12-1 (2006-03, t) * IEC 60512-12-2 (2006-02, t) * IEC 60512-12-3 (2006-02, t) * IEC 60512-12-4 (2006-02, t) * IEC 60512-12-5 (2006-02, t)

IEC 60512-11-2 (2002-02, t)*IEC 60512-11-3 (2002-02, t)*IEC 60512-11-4 (2002-02, t)*IEC 60512-11-5 (2002-02, t)*IEC 60512-11-6 (2002-02, t)*IEC 60512-11-7 (1996-01, t)*IEC 60512-11-8 (1995-11, t)*IEC 60512-11-9 (2002-02, t)*IEC 60512-11-10 (2002-02, t)*IEC 60512-11-11 (2002-02, t)*IEC 60512-11-12 (2002-02, t)*IEC 60512-11-13 (2002-02, t)*IEC 60512-12-1 (2006-03, t)*IEC 60512-12-2 (2006-02, t)*IEC 60512-12-3 (2006-02, t)*IEC 60512-12-4 (2006-02, t)*IEC 60512-12-5 (2006-02, t)*IEC 60512-6*CEI 60512-6 * IEC 60512-6 (1984)

Adhesive strength * Atmospheric pressure * Climate * Climatic loading * Climatic tests * Components * Damp-heat tests * Destructive testing * Dip soldering * Electric connectors * Electrical components * Electrical engineering * Electromechanical * Electromechanical devices * Electromechanics * Electronic engineering * Electronic equipment * Electronic equipment and components * Electronic instruments * Environmental testing * Heat * Heated-bit soldering * Humidity * Inspection * Inspection specification * Leak tests * Measurement * Measuring techniques * Mechanics * Moisture * Pressure * Printed-circuit boards * Solderability * Soldered connection * Soldered joints * Soldering * Soldering irons * Solubility test methods * Specification (approval) * Temperature * Testing * Testing conditions * Thermal stability * Windings * Wrapped connections * Temperature test * Solderless connections * Soldering heat * Resistance * Solder bath method * Low pressure * Stress * Gas tightness * Coldness * Soldering processes

31.220.01. Thành phần điện cơ học nói chung

53